14 DAY TRIAL // Sony may not have quite reached the theoretical maximum data rate of the TransferJet technology, but it figures it has gotten close enough to start selling a new such chip.
Sony has announced that the TransferJet technology is now ready and eager to be used by IT companies in the making of smartphones, tablets and other mobile devices.
Such products can already communicate with each other, most often via Bluetooth, but Sony believes its new LSI is better than anything out there right now.
Though it relies on the proximity between two gadgets, the TrensferJet chip can send data at up to 350 Mbps.
This is just shy of the theoretical maximum of the interface standard: 375 Mbps.
The name of the chip that supports high-speed SDIO UHS-I as its host interface is TransferJet LSI CXD3271GW.
Its sensitivity is of -82dBm when receiving Rate65, a number better than the standard value of -71dBm.
Another asset is that a dedicated external crystal controlled oscillator is no longer required for supporting a multi-reference clock.
Furthermore, Sony was able to integrate the LDO and OTP-ROM, as well as the RF switch for transmitter/receiver, directly into the new LSI chip.
A lower power consumption and smaller footprint are the welcome side effects of this reduction in the number of chip parts.
Of course, even if Sony has these things up for order, mobile device makers aren't just going to flock to them without the assurance that the item is a worthwhile addition to the spec sheets of their own products.
Knowing this, Sony will provide a software development kit for Android. Previous versions of TransferJet came with a kit for Linux. In the near future, Sony will probably provide a kit for Windows 8 as well.
Sony's announcement has the specs, but for those who want a quick rundown, the bottom line is this: operating wireless frequency of 4.48GHz, chip rate of 560Mcps, automatic transmission rate selection and 96pin WFLGA package.