14 DAY TRIAL // The amount of digital ink that has been flowing online to cover the Snapdragon 810 overheating issues are getting a massive boost this week, as new information related to the topic has just emerged.
But first for a bit of history. Qualcomm’s latest high-end platform which was supposedly going to go in spring’s major flagship was rumored to be suffering from pesky overheating issues the company just couldn't overcome.
Soon afterwards, it was revealed that Samsung would be renouncing Qualcomm’s services and would be using its own home-grown Exynos 7420 platform to power the Galaxy S6 flagship.
Qualcomm wasn't obviously too happy about that, so it retaliated by spurting out a lengthy praise of the platform and its “miraculous” properties.
On top of that, manufacturers like LG (who uses the chip for its G Flex 2 handset) have stepped forward claiming that the chip does not suffer from overheating issues whatsoever. More than that, in their concept, the silicone piece is the least prone to do so they have ever seen so far.
Now fast forward to the present, as a bunch of benchmark test results have leaked into the wild, which suggests that the Snapdragon 810 overheating issues have been fixed.
In all possibility, we’re dealing with the Rev.2 S810 version which Qualcomm has in the works, which is a revised variation of the chip that comes devoid of overheating problems.
LG G Flex 2 has a defective chip?
In the meanwhile, the folks over at Android Police have apparently been testing a device running the Qualcomm Snapdragon 810 platform for the last few days. It’s probably the LG G Flex 2 since the handset has been launched in South Korea and will be making its way to more markets towards the end of the month.
One of these tests involved putting the G Flex 2 through GeekBench, which showed how the device handles heat caused by continuous use. Here are the results of the multiple tests, broken down in single-core and multi-core results:
1. 1215/3683
2. 1112/3249
3. 895/2931
4. 672/2414
5. 692/2465
6. 675/2421
7. 663/2356
8. 617/2263
9. 558/2065
These tests were continuous, so there was no resting period between one and the next. As you can see for yourselves, starting with the second benchmark performance starts to decrease and never ceases to drop until the end.
By the ninth time, single-core performance is almost cut by half, while multi-core performance is reduced by 40%.
The reason behind all this is related to thermal throttling. The LG G Flex 2 in itself will not become hot, but the phone’s overall performance will not be a fluid one over prolonged use.
To compare, have a look at the results obtained through the same cycle of 9 GeekBench tests done on the Galaxy Note 4, which bundles the Snapdragon 805.
1. 1081/3136
2.1092/3332
3.1093/3237
4.1086/3244
5.1090/3305
6.1087/3202
7.1088/3195
8.1086/3173
9.1090/3238
As you can see, even if a change in temperature is revealed, the scores between the first and last tests don’t differ all that dramatically. So the difference between the Snapdragon 805 and Snapdragon 810 is pretty wide.
Luckily, it appears Qualcomm has managed to fix the problems, as we were telling you above. However, the question remains, will the LG G Flex 2 ship out with the next version of chip or not?