Samsung is trying to cover its back while it still can

Jan 15, 2015 13:25 GMT  ·  By

Today the Xiaomi Mi Note Pro went live, marking the second smartphone with the Snapdragon 810 chip on the inside to get officially unveiled after the LG G Flex 2.

But the company didn't provide an exact date for when we can expect to see the device arrive in retail. It’s not uncommon for manufacturers to do so, but given the fact that we’re dealing with the Snapdragon 810 here, we have to wonder.

According to industry sources, the chip might get delayed because Qualcomm is trying to fix some overheating issues plaguing the new silicone bundle.

The Snapdragon 810 is a high-end SoC which is expected to make its way into most of 2015’s major flagships including the Samsung Galaxy S6, LG G4, HTC Hima or Sony Xperia Z4.

Samsung says "thanks, but no thanks" to the Snapdragon 810?

But it seems that Snapdragon 810 delay rumors have been growing stronger that even the almighty Samsung is fearing the outcome.

And according to sources familiar with the matter reported by DigiTimes, Samsung will no longer be putting its apples in the Snapdragon 810 basket.

The report claims that for its upcoming Galaxy S6 flagship, Samsung is counting on its Exynos platform. Apparently 80% to 90% models of Galaxy S6 will be powered by silicone from the Korean giant’s own garden. The rest of 10% will be reserved for Snapdragon 810, if it eventually shows up.

If, and only if, Qualcomm fixes the overheating problems, Samsung will go on to raise the percentage of Galaxy S6 models that will come bundled with Snapdragon 810.

Since the Samsung Galaxy S6 is expected to be unveiled in early March at MWC 2015 in Barcelona, it’s understandable that Samsung is trying to play the safe card here.

In about a month and a half, the Korean tech giant should unveil its latest flagship and Qualcomm’s delay in dealing with the chip issue could end up relaying Sammy’s plans.