14 DAY TRIAL // Samsung, one of the world's leading manufacturers of advanced memory technology, has just announced that it has started developing an 8Gb Flex-OneNAND fusion memory chip, using the next-generation 40nm manufacturing technology. This product has been designed to combine both SLC and MLC NAND in a single cost-efficient chip, providing the high performance and high reliability required by a number of applications.
“Forty nanometer Flex-OneNAND is a tremendous advancement for the memory industry, one which offers a uniquely cost-effective approach to memory selection, while permitting designers the flexibility of adjusting designs up to the final design stage,” said Jim Elliott, memory vice president, Samsung Semiconductor, Inc.
According to Samsung, its Flex-OneNAND product is expected to be featured in a number of high-performance devices, including some of today's smartphones, HDTVs, IPTVs and other high-end applications due to become available by the end of the year.
The adoption of the next-generation 40nm class technology enables Samsung to achieve increased productivity compared to the 60nm-class technology. Apparently, an increase of up to 180 percent is enabled by the adoption of the new manufacturing technology. Also, compared to previous products, the new Samsung Flex-OneNAND will boast a capacity of 8Gb.
The company developed the Flex-OneNAND back in 2007, enabling a product that incorporates both SLC and MLC NAND in a single piece of silicon. This allows application designers to choose the portion of the SLC and MLC NAND storage that will be used in any particular design. In addition, Samsung has included software, design to support a system level interface for embedded memory. This enables mobile phone makers to introduce high-density embedded memory in their next-generation mobile devices.
According to Samsung, the high data transfer speed achieved by the next-generation embedded memory will enable upcoming mobile phones to boast from 1GB to 32GB of embedded memory.