Offers 18 configurations

Mar 19, 2009 09:11 GMT  ·  By

Back in early February, Samsung Electronics, a world leading manufacturer of high-performance memory products, announced that it had begun the mass production of its first 50nm-based GDDR5 memory chips. Approximately one month after the February announcement, the company started shipping the world's first and smallest high-density memory modules, based on the new 2-gigabit (Gb), 50 nanometer-class DDR3 memory.

 

According to Samsung, 18 configurations of its high-density, high-performance, sever-grade DDR3-based modules have been made available for users wanting to upgrade to the latest technology. Among these configurations there's a 16-gigabyte (GB) registered inline memory module (RIMM) and an 8GB RDIMM (registered dual inline memory module). The 16GB high-density module is specified at an operating speed of 1066 Megabits per second, enabling a sever memory configuration of up to 192GB of memory in a dual-socket server system.

 

Samsung says that the new 2Gb DDR3 memory consumes at least 40 percent less power than a 1Gb configuration, a feature that is critically required in the sever system industry, as well as the next-generation of portable computer systems, which need a better battery life.

 

With the announcement, the company is also the first to offer 16GB RDIMMs with an operating voltage of 1.35 volts, enabling a 20 percent saving in power consumption over 1.5V DDR3 solutions.

 

Samsung's latest DDR3 offering is in accordance with the market transition to the new DDR3 memory standard. According to the market research firm IDC, the global market for DDR3 memory is expected to reach 29 percent in 2009, while that number will increase to 75 percent in 2011.

 

Samsung is clearly a leader in the adoption of new technologies and provides better and higher-performance memory products. Earlier this month, the company announced that it started production of the first 40nm-based 8GB Flex-OneNAND fusion memory.