Samsung has not been sitting idly by the side of the server market as things moved forward, having chosen, instead, to actually try and steer things its own way, this once revealing a power-efficient, 32 GB DDR3 module.
Consumers may be awed by the sight of an 8 GB and even some 4 GB memory modules, but there is a certain segment of IT where such capacities are seen as mild at best.
Basically, the server market is a place where 16 GB and even 32 GB modules have every chance of being encountered.
Samsung is one of the companies that have a significant stake in this field, having recently even completed a new 32 GB module.
In fact, the official announcement was made just a short time ago and describes an item based on three dimensional (3D) through silicon via (TSV) package technology.
The goal was to allow the memory to draw on significantly less energy compared to other product of this variety.
Goal achieved, the 32 GB RDIMM (registered dual Inline memory module) consumes 4.5W per hour and is said to be the lowest among anything used in the enterprise sector at present.
In other words, through use of 3D TSV, the newcomer saves 30% power compared to regular 32 GB LRDIMMs (load-reduced, dual-inline memory modules) based on the same manufacturing process (30nm).
“These 32GB RDIMMs fully support the high-density and high-performance requirements of next-generation high-capacity servers,” said Wanhoon Hong, executive vice president, memory sales & marketing, Device Solutions, Samsung Electronics.
“We will keep providing memory solutions with higher performance and density, while enhancing shared value in the design of ever-greener server systems,” he added.
Prices aren't mentioned, but this final bit of info will emerge whenever the mass production stage is reached. Right now, only sample shipments are being sent out.
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