14 DAY TRIAL // Most of the news involving DDR4 memory has been about DIMMs, the type of modules that normal computers use, insofar as X99-based PCs with Haswell-E CPUs can even be considered normal.
However, other types of DDR4 memory have begun to emerge. We've already seen the LPDDR4 specification from JEDEC, which describes the DDR4 suitable for laptops, LPDDR4.
Now, Samsung has revealed another type of RAM, called DDR4 RDIMMs (Registered Dual Inline Memory Modules) based on 3D “through silicon via” (TSV) package technology.
In 3D TSV manufacturing, the chip dies are ground down to a few dozen micrometers, then pierced until they are dotted with hundreds of fine holes.
Electrodes are then passed through the holes, stacking and connecting the DDR4 chip dies together, vertically, thus increasing both capacity and performance.
Currently, the top number of stacked DDR4 chip dies is four, but in the future, Samsung plans to increase that number.
The new 64 GB DDR4 DRAM RDIMMs have 36 DDR4 chips each, meaning that the individual chips have 4 Gb of storage.
Performance is superior to 64 GB DIMMs with normal, wire bonding packaging technology. In fact, it is said to be twice as good. Meanwhile, power needs are cut in half.
That's right, the new RAM is both more efficient and superior in performance, so we suppose we could say that Samsung's 64 GB DDR4 3D TSV RDIMMs are four times better than regular 64 GB DDR4 modules.
It kind of makes us wonder if 128 GB modules will be released next year. We suppose it's an extension of another promise in regards to DDR4 memory.
You see, normal DDR4 DIMMs don't come in more than 8 GB right now, and this won't change before mid-2015 or so. But motherboards can handle 16 GB per module, which means that the new ones that keep coming out will support 128 GB in total, via 8 slots.
The new RAM is intended for consumers, as Samsung intends for the new RDIMMs to be shipped to enterprise servers and cloud-based data centers. But it still makes us wonder if we'll see 128 GB RDIMM DDR4 modules soon. All it would take would be to double the die thickness really.
If only the implementation were as easy as it sounds. Alas, it is not, or Samsung would have unveiled a TSV DDR4 product of more than 64GB. Then again, maybe it's staggering the product releases in order to preserve momentum, instead of burning itself out, idea-wise.
