14 DAY TRIAL // Although 4GB is the biggest capacity that desktop DDR3 memory modules have, the situation is not the same in the server industry, and Samsung has just proven this yet again by revealing a very low profile module that, even at a height of only 18.75 mm, has a capacity of 16GB.
The company seems to have outdone itself, as its newest creation is not only small and capacious, but also quite energy efficient.
In fact, the 4Gb dual-die packaged (DDP) chips, 18 in number, can work on a voltage of just 1.35V and consume 7-% less electricity that four 4GB DDR3 modules combined.
What's more, compared to two 8GB modules, the 16GB DIMM (dual in-line memory module) eats up 40% less energy.
Also, according to the press release, “the module consumes up to 20 percent less power than a 1.5V DDR3 and over 80 percent less than a 1.8V DDR2.”
For the most part, these intriguing specifications were made possible by the fact that Samsung used DRAMs based on the 40nm manufacturing process technology.
The company intends to demonstrate its new product at VM World 2010, by putting them inside an IBM H22V blade server, based on an Intel Xeon 5600 processor.
"High density, low-profile memory can allow for increased performance on database applications and offer advantages when it comes to power usage and savings, “ said Brian Sanders, director of marketing, System x, IBM.
“Samsung's module is helping us deliver up to 50% more total memory capacity on our IBM BladeCenter Servers, enabling support for more virtual machines," Sanders added.
The high-density VLP DDR3 are already shipping as part of not just IBM HS22V servers, but also HS22 systems.
Each IBM HS22V server can cram up to 288GB of memory if they use the 16GB DIMM in question, while an HS22 can go as high as 192GB.