14 DAY TRIAL // Future high-end smartphones might indeed become as powerful as laptops and other computers are today, given that SK Hynix has already announced 20nm 8Gb (1GB) LPDDR3 chips for inclusion in devices before the end of the year.
The company’s chip is said to provide data transmission speed of 2,133Mbps, and to support high density of maximum 4GB (or 32Gb) packages, while featuring a thinner profile and less power consumption in standby when compared to LPDDR2.
The company also announced that the new 20nm RAM could be provided in forms that include ‘PoP’ (Package on Package), as well as in a single package with ‘eMMC’ (embedded Multi Media Card).
SK Hynix expects high density LPDDR3 memory products over 2GB to be included in top-level mobile devices in the second half of the year.