Paper leaks details regarding Apple’s component providers for iPhone 4G

May 5, 2010 14:25 GMT  ·  By

Digitimes claims to have received word that Taiwan will soon be tapped to provide components for Apple’s fourth-generation iPhone. Foxconn, the company responsible with the final assembly, has reportedly been receiving components from the various suppliers starting with April.

The site in question notes that, “A host of Taiwan-based component makers will receive orders for Apple's iPhone 4G,” citing a Chinese language Economic Daily News report. It adds that Foxconn, which also handled the iPhone 3GS assembly, “will again assemble the new device, and Chimei Innolux will join previous panel suppliers TPK Touch Solution and Wintek in providing touch-panel modules for the iPhone 4G.” Foxconn is already in the possession of several components making up the 4G iPhone, Digitimes claims.

A chart is provided (pictured above) with a breakdown by components and their respective suppliers, as well as a few relevant annotations. EDN receives full credit for the information, Digitimes reports. The latter compiled the data earlier this month.

According to the chart, assembly will be handled by the aforementioned Foxconn (which also assembled the newest iPhone model); touch panels will be produced by TPK, Wintek, and Chimei Innolux with their respective 45%, 40% and 15% orders; quartz components are reportedly in TXC’s jurisdiction – the company has previously supplied only 15% of the iPhone’s quartz components, but has now been tapped for some 45% of these parts; PCB is handled entirely by Kinsus with 100% of orders; the camera module is Largan Precision’s and Genius Electronics’ responsibility with 80% and 20% of orders, respectively; the flexible copper clad laminate is to be produced by Taiflex Scientific, which previously supplied some of the iPhone 3GS FFCL, but now has been ordered to supply three times that amount; delivering X-ray testing equipment is Leadertek’s job, according to the same chart, with 100% of orders for this component.