The Taiwanese computer hardware manufacturer Hynix Semiconductor is one of the well-established companies that are active in the field of computer memories, both video and system ones. While video intended memories do not get really big, there is a very strong tendency among computer users and manufacturers to use big system memories on just any types of machines now.

Nowadays, computer systems sporting anywhere between 1GB and 2GB of DRAM are common and the trend is to keep increasing that memory amount as newer operating systems like Microsoft's Windows Vista and new 3D games come along. While desktop computing systems are traditionally blessed with bigger DRAM capacities, Hynix Semiconductor decided to invest heavily into the mobile computing segment and develop a faster and bigger density memory module. Currently they reached a high density of one gigabyte on a single memory chip made using the 66 nanometer fabrication process.

Jumping from the 90 nanometer process to the 66 one lets the manufacturer reach a higher circuit density as well as increase the clock speed. The 1GB mobile memory chip can achieve a maximum clock frequency of 200MHz and a data transport bandwidth of 1.6GB per second when used in conjunction with operating system based on 32 bits. According to the manufacturing company cited by the news site DigiTimes, the new memory module draws very little power so it is well suited for a wide range of mobile devices.

The 1GB memory inside a single chip is part of Hynix's 'one-chip solutions' family of products that is noted for combining different types of memories and 16 or 32 bit interfaces. The mass production of the new memory chip will begin during the first months of 2008 and the manufacturer said that offerings will include multi-chip package (MCP for short) with NAND flash inside, package-on-package (POP) and known-good die (KGD).