OCZ Unveils Vendetta 2 CPU Cooler, Gives Heat a Blow

Cooling specialist OCZ technology has just unveiled the new OCZ Vendetta 2 CPU cooler, that comes now with a more powerful, 120-millimeter fan design. The second incarnation of the extremely efficient cooler has been previously showcased during the CeBIT show, but the company kept it unofficial until now.

The new cooler in the Vendetta family uses a stacked fin design and three 8-millimeter copper heatpipes that are placed directly onto the processor, the Vendetta 2 offers the fastest heat dissipation time, when running on the hottest quad-core powerhorses.

The heat-pipe direct touch (HDT) design offers Vendetta's heat-pipe system to absorb excessive heat directly from the processor's package. The three 8-millimeter copper pipes can rapidly absorb heat, then conduct it upwards through the stacked fins. The dimple micro-configuration of the stacked aluminum fins not only that enlarges their contact surface with the airflow, but also prevents the air from making the annoying hissing noise as it passes through the aluminum fins.

The high-performance 120-millimeter cooler delivers a strong, constant airflow while working at low noise levels. It is built on the rifle bearing technology, that allows it to spin at 800 to 1500 rotations per minute at a noise output ranging from 20 to 32 dBA. In order to prevent vibrations, the cooler is mounted on anti-vibration rubber dampers that also reduce the excess noise.

The powerful Vendetta 2 cooler can be installed on both AMD and Intel processors that are compatible with the AM2/939/754/755 or 775 sockets. The cooler heatsink without the installed fan measures only 120 x 50 x 159 millimeters, which makes it suitable for almost any regular ATX-based computer case. Installation is extremely simple and can be performed by the end-users at all skill levels.

The Vendetta 2 will become available soon. Inside the package, you will also find OCZ's famous silver-based thermal compound. At the moment, there is no word on pricing.

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