14 DAY TRIAL // OCZ Technology just keeps on coming with new stuff. But since they are primary a memory producer, maybe 50% of their innovative ideas are related to the DDR2 field. For example, the new (and yet unreleased) Flexpipe memory cooling device is being built around a single heatpipe that lies at about 1cm above the actual stick.
The heatpipe's position is very good especially if your case has sufficient air flow. I say that because there is enough room under and over the heatpipe for the air to move and cool down the heatspreader which is mounted on it.
The new memory design is currently in pre-production mode and won't be in the stores for at least 3 months because of the testing procedures that will last at least 2 months. But we know it works, so we are not worried.
As you may remember, OCZ has also announced in the last weeks the mass releasing of FlexXLC modules which had the ability to use both air and liquid cooling. Regarding the new memory line and its place in OCZ's hierarchy, Alex Mei, OCZ Technology Vice President of Marketing and Communications claimes that: "the Flexpipe is mainly designed for a memory platform above the OCZ XTC series memory, but will be priced more aggressively than FlexXLC modules."
I love OCZ's "less is more" concept, but keep in mind that these sticks will have to face a fierce competition, especially from the latest Dominators coming from Corsair. Needless to say that - in order to be competitive - the new OCZs have reach at least 1200MHz DDR2 when running at default clock speeds. I say that because Kingston, Patriot and Corsair already possess modules capable of working well beyond the 1200MHz mark.