OCZ Technology, a worldwide leader in terms of high-performance memory products, has announced today the introduction of its new Blade Series Triple Channel Memory kit, specifically designed to provide new Intel Core i7 users with the necessary memory support, in a high-performance package.
The company's latest triple-channel memory kit is meant for X58 platforms and comes as an alternative to similar products on the market, providing features such as industry-leading speeds and low-voltage specifications, required by Intel's Core i7 processors. With the new release, OCZ basically provides computer enthusiasts with a new product that they are likely to integrate in their high-performance desktop platform.
“Within any extreme performance computer, the memory subsystem holds a key position for storing and delivering the data to the processor in the fastest possible manner,” commented Dr. Michael Schuette, VP of Technology Development at OCZ Technology. “Using a triple channel configuration custom tailored towards Intel’s Core i7 platform, the latest OCZ Blade Series kits epitomize the pinnacle of memory technology by delivering 2000MHz data rate for an available bandwidth of 35GB/sec to satisfy even the most data-hungry processor in the current marketplace.”
As far as specifications are concerned, the new OCZ DDR3 triple-channel memory kit can provide a high-speed level of 2000MHz, while the latency levels have been maintained at a low (for DDR3 standards) CL 7-8-7-20. These are 1.65 Volt, 240 Pin DIMM memory modules that boast a pure aluminum heatsink to effectively reduce temperatures, consequently providing a high level of performance.
The black, heatsink-equipped Blade series DDR3 memory kits will become available in 6GB (3 by 2048) memory configurations, basically providing enthusiast users with just enough performance potential to blast away through any benchmarks or high-end gaming applications on the market.
Unfortunately, the company hasn't revealed any details regarding the pricing of the new Blade 2000 Series memory modules, but it has said that they will be showcased next month at CES in Las Vegas, Nevada.