With motherboard makers having already started announcing the debut of their first P55-based motherboards, it comes as no surprise that all the other hardware vendors are also showing support for the new mainstream platform. On that note, the San Jose, California-based OCZ Technology has announced today the debut of its new low-voltage DDR3 memory, specifically designed to provide users with support for the new Intel P55 Chipset and the upcoming series of Core i7, Core i5 and Core i3 socket LGA1156-compatible processors. The new DDR3 memory will be available in dual-channel kits, boasting a capacity of 4GB.

“OCZ is excited to introduce a complete range of new DDR3 dual channel memory kits that are engineered specifically for Intel’s cutting edge P55 platform,” commented Alex Mei, CMO for the OCZ Technology Group. “These gaming kits make use of high quality hand screened chips to deliver exceptional performance and stability at surprisingly low voltages when paired with the latest Intel processors and chipset.”

The memory vendor has released several new memory kits, available as part of the company's Gold and Platinum lines of low-voltage memory modules. Available in kits of 2x2GB modules, the new DDR3 memory from OCZ can be found in several configurations, boasting different latency specifications. From 7-7-7-20 to 10-10-10-27, these new solutions are expected to provide consumers with a memory choice for their upcoming Intel-based mainstream desktop systems.

Aside from the high level of performance that they can provide, the new modules have been equipped with the company's XTC (Xtreme Thermal Convection) heatspreaders, designed to effectively dissipate the heat over the memory ICs. Unfortunately, OCZ hasn't released any details regarding the pricing and availability of its new memory kits, but they should become available really soon, following the official introduction of Intel's much-anticipated mainstream platform refresh.