OCZ Produces Liquid Cooled Memory Modules

OCZ Technology has produced its first water cooled memory modules and is ready throw them at the enthusiast market. It is not the first product of this kind we see but it is definitely the most impressive. PC2-9200 FlexXLC memory sticks use a unique cooling solution developed with the sole purpose of cooling the chips better than any passive or air cooler could. The heatsink has two connectors at the top which have to be connected to the water pump in order to actively cool the memory down.

About its newest product OCZ says: "Water-cooling is more efficient than air cooling, yet standard memory kits are usually not available in off-the-shelf water-cooled configurations," commented Dr. Michael Schuette, VP of Technology Development at OCZ Technology Group. "The new OCZ FlexXLC series-featuring an exciting, novel hybrid water and air cooler based on OCZ's embedded copper liquid injection system-pushes thermal management of memory modules one step further to keep up with the ever-increasing frequency demands. Moreover, the FlexXLC modules seamlessly co-migrate with any system upgrade to liquid cooling."

In addition to the memory being cooled with water, the new modules also use an 8-layer PCB which features thermally conductive power and ground planes. That improves the cooling by a large factor but also boosts the signal integrity through the PCB.

OCZ PC2-9200 FlexXLC modules will be available in 2x1GB kits and as other top OCZ products, they will feature lifetime warranty. The sticks are expected to hit the stores by the end of the week with pricing unknown at the moment.