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April 10th, 2009, 07:39 GMT · By

OCZ Delivers XPM Memory for High-End Laptops

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OCZ unveils new XMP-rated SODIMMs
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The pace technology is growing at enables computer system vendors to provide users with some of the highest-performance portable PCs on the market. These machines are built using the latest in hardware technology, including Intel's Core 2 Extreme mobile processors and high-end memory modules, such as OCZ's newly launched XPM-certified SODIMMs. These new modules have been specifically designed to meet Intel's Extreme Memory Profile, enabling computer enthusiasts to take advantage of the latest in portable computing solutions.

“XMP is for performance what 3D is for games, and the introduction of the profiles allows on-the-go enthusiasts to make the most of their Intel mobile platforms,” commented Dr. Michael Schuette, VP of Technology development at OCZ Technology. “As a result for our involvement with Intel from the very beginning of the mobile XMP concept, today we are releasing 2GB high performance SODIMMs designed as a no-compromise solution to complement Intel’s mobile computing platform for the ultimate user experience.”

OCZ unveils new XMP-rated SODIMMs
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The first of the company's XPM-ready SODIMM memory solutions will become available in the form of the new CZ DDR3 PC3-8500 4GB kits or single 2GB modules. These are designed to work at 1066MHz with CL 6-6-6 latencies and are compatible with Intel's Core 2 Extreme processor family and Centrino 2 platform. These latest solutions from OCZ will enable computer enthusiasts with an option for upgrading their portable gaming rig, thus boosting the overall performance of the system.

OCZ's new 204-pin SODIMMs are featured with Intel's Extreme Memory Profiles (XMP), an exclusive set of SPD (Serial Presence Detect) settings, enabling a quick upgrade solution for high-end systems. They're rated to work at 1.6 Volts and are backed by a lifetime warranty. Unfortunately, the memory vendor hasn't provided any details on the pricing of its new XPM SODIMM memory.

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