14 DAY TRIAL // OCZ Technology Group recently announced the launch of yet another high end DDR2 random access memory kit that is aimed at the extreme gamers and computer enthusiast market segments as it offers the ultimate gaming performance along with high overall system responsiveness. This new memory kit is the latest addition to the high end OCZ Nvidia SLI certified memory modules, the very first in the world 4GB PC2-6400 SLI-Ready DDR2 modules, which are specially optimized for use in conjunction with the latest generation of mainboards centered around Nvidia nForce desktop chipsets.
The new random access memory kit comes with a nominal capacity of 4GB and it is equipped with NVIDIA Enhanced Performance Profiles, EPP for short, that allows users to optimize the behavior of the memory modules according to the current tasks, scaling their performance and power consumption accordingly. OCZ designed and manufactured these new memory kits with advanced Serial Presence Detect, SPD for short, settings and so the compatible mainboards can read the additional information and scale the performance of the memory sub-system when needed.
The new OCZ designed and manufactured PC2-6400 4GB SLI-Ready memory modules are running at a clock frequency of 800MHz while using tight latency timings of 5-4-4-18 and they are available for purchase in kits of two modules of 2GB each that are perfectly suited for a desktop computer system that can make good use of a dual channel memory configuration.
The standard voltage of the new OCZ DDR2 memory modules is set to 2.1V, but the presence of the Extended Voltage Protection, EVP for short, feature allows users to increase the voltage to 2.2V without compromising the stability of the system.
In order to assure the best possible operational status and increase the overall stability and responsiveness of the computer system, the new OCZ Nvidia certified memory kits are coming equipped with the OCZ patented heat dissipation technology, the Xtreme Thermal Convection heatspreaders. These custom-made heatspreaders are increasing the amount of dissipated heat by promoting greater airflow by means of micro-convection and thus greatly enhancing the stability of the memory sub-system even under heavy workloads.