Nokia just announced closing of a deal with STMicroelectronics in order to deepen their collaboration. The two companies announced their intention on collaborating on the 8th of August, this year and seem to have stuck to the promise.

As a result of the new agreement, approximately 185 highly-skilled engineers and other Nokia personnel in Finland and UK to STMicroelectronics. This makes the best possible proof of their interest in working together over a long period of time. Moreover, it should make it possible for Nokia to have an inside view on how things are developing with the 3G chipset development. Having people from both the two companies should lead to better results and a tighter business bond.

As a result of the closing, a core part of Nokia's Integrated Circuit (IC) operations will be transferred to STMicroelectronics. Moreover, it positions them to take into consideration when designing and manufacturing 3G chipsets, Nokia's needs. This means that they will keep in mind the Finnish handset producer's modem technologies, energy management and RF (radio frequency) technology. All this should have a great contribution in their delivery of complete solutions to Nokia and the open market.

STMicroelectronics will also be the one to bring advanced 3G HSPA (high-speed packet access) chipset supporting high data rates. As the mobile phone data storage space increases, users also want evolved solutions for transferring their personal and media files at top speeds. Still, it's the first complete 3G chipset coming from ST, which proves the fact that Nokia granted them a great deal of confidence with making it possible.

STMicroelectronics is a global leader in developing and delivering semiconductor solutions across the spectrum of microelectronics applications. The company has a long time partnership with Nokia, which makes this contract only a carrying on of previous similar deals.