14 DAY TRIAL // DRAM (dynamic random access memory) comes in several standard form factors, like DIMM for desktops and SO-DIMM for laptops, but SMART Modular Technologies figured it was time for a new type.
Lo and behold, the MIP has been introduced. Short for module-in-a-package memory form factor, it crams 2 GB or 4 GB of RAM in a dual-chip array the size of a small coin.
Clearly, all those advancements in manufacturing technology nodes are being put to good use.
The MIP not only brings a smaller size to the equation, but also provides a 42% improvement in power savings. What's more, the jitters are reduced by the same percentage.
"SMART has been stacking off-the-shelf DRAMs for many years providing key space-saving benefits to OEMs," stated Mike Rubino, SMART's vice president of engineering.
"The MIP is a natural extension of this expertise furthering SMART's commitment to deliver high quality, high reliability unique memory solutions."
The new memory module from SMART is aimed at mobile routers, high-end video/graphics cards, broadcast video, embedded computing applications, etc.
Thus, the networking, telecom and general computing industries will be SMART's main customers for MIP. Both the 2 GB and 4 GB chips run at DDR3-2133 MHz frequency.
Basically, if power consumption, space limitations and performance are factors that need equal attention, you have your solution.
What's more, since this is a soldered down module, there is no need for a mating connector, unlike on SO-DIMM RAM.
Furthermore, the SMART MIP supports both ECC applications (error correcting code) and programs without it.
The first live demo of the MIP will be held by SMART on February 25, 2014, at the Embedded World 2014 Exhibition & Conference in Nuremburg, Germany. We can only wonder how long it will take the company to make DDR4-based chip modules like this one.