NEWS CATEGORIES:



NEWS ARCHIVE >>
SOFTPEDIA REVIEWS >>
MEET THE EDITORS >>
Home / News / Technology

Technology


National Semiconductor TruTherm Technology

Pinpoint-accurate temperature readings for microprocessors

By Anca Rusu, Technology Editor

28th of August 2006, 13:13 GMT

Adjust text size:


After launching the patented TruTerm Technology, back in 2005, National Semiconductor Corporation (NSC) launched a series of advanced high-precision, remote-diode temperature sensors that are based on this beta compensation technology.


More precisely, the TruTherm technology solves the problem of inaccurate remote temperature readings determined by variations in the internal diodes in deep sub-micron microprocessors, microcontrollers, application-specific integrated circuits (ASICs) and field-programmable gate arrays (FPGAs). If you didn't know, incorrect remote temperature readings can determine a dramatic increase of the acoustic noise and a general decrease of the system's optimal functioning.

Therefore, National's TruTherm thermal management products are said to improve the accuracy of temperature readings, enabling designers to attain higher performance and efficiency in their applications, while lowering cooling-fan speed, reducing acoustic noise and extending system life.

These sensors are especially designed for applications such as mobile and desktop workstations and servers powered by high-performance microprocessors manufactured on 65 and 90 nm (nanometer) processes.

"Thermal management is becoming increasingly important in today's electronics applications, which are growing more complex while also shrinking in size. Accurately monitoring temperature in computing products and complex cores is key to ensuring protection against malfunction or failure due to excessive heat," said Susie Inouye, research director and principal analyst with market research firm Databeans. "Thermal management technology such as National's TruTherm products allows designers to successfully monitor these complex cores that are designed on very small sub-micron geometries and continue to push the limits of heat dissipation."
Read by 1,324 user(s) | Add comment | Link to this article TWEET THIS


Article rating:
Fair (2.5/5) 4 vote(s)    

Subscribe to news | Print article | Send to friend

© Copyright 2001-2009 Softpedia
Contact:

 

 

SEARCH THE NEWS ARCHIVE :




Today's News
| Yesterday's News | News Archive


MORE RELATED ARTICLES:


DoCoMo Starts Using HSDPA Technology

A Development Promising to Change the Espionage World

Washington DC Technology Council Organized 'The Business of Technology in DC'

Gemalto Will Create the First Smart Card-Based Healthcare System

Cheap Phone-tracking Technology for Business Launched in UK

BBE M3 Mobile Audio Technology

User opinions:

No user comments yet.
Be the first to express your opinion using the form below!

Share your opinion:

Your Name:
Your Email Address:
(will not be used for commercial purposes)
Solve this to prove you're not a bot: =
Your review/opinion:

 




Windows tabGames tabDrivers tabMac tabLinux tabScripts tabMobile tabHandheld tabGadgets tabNews tab

SUBMIT PROGRAM   |   ADVERTISE   |   GET HELP   |   SEND US FEEDBACK   |   RSS FEEDS   |   ENTER NEWS SITE   |   ENGLISH BOARD   |   ROMANIAN FORUM