NXP Provides the World's Smallest WLAN Solution for Handhelds

NXP, the independent semiconductor company founded by Philips, recently announced the availability of BGM220, the world's smallest, single-package 81-pin TFBGA, Wireless LAN (WLAN) solution, with ultra low power consumption optimized for handheld applications such as feature phones and smartphones, handheld game consoles and PDAs.

The BGM220 builds on its predecessor, the BGW211, and brings even greater benefits to OEMs by offering a significantly smaller form factor and highly optimized dynamic power management. The new version uses the 802.11b/g WLAN standard to enhance the user connectivity experience, with a form factor allowing manufacturers to develop even smaller handheld devices. Configured for maximum energy efficiency, the BGM220 has ultra low power consumption optimized for mobile phones and handheld devices. The BGM220 also provides extended wireless access by enabling simultaneous Bluetooth and WLAN connectivity.

The BGM220 is a full WLAN solution, including the RF and Baseband/MAC functions, in a single 5mm x 5mm TFBGA package that supports the SDIO/SPI host interfaces. Using industry-proven silicon from NXP's existing products, the BGM220 provides OEMs with a range of benefits, such as low-cost implementation, enhanced performance and flexibility to provide additional cost/performance tradeoffs, while also helping speed time to market.

The BGM220 comes equipped with driver support for all major operating systems, including Windows Mobile, Windows CE, Symbian and Linux, and is designed to support a single antenna for Bluetooth and WLAN.

It will be available for sampling during the second quarter of 2007, and mass production will commence sometime during the fourth quarter of 2007.