Mushkin Introduces Ascent XP DDR Lineup with Vapor Chamber Cooling

Memory specialist Mushkin has just announced its latest memory offerings in the DDR2 and DDR3 families of products. The new memory modules are branded as Ascent XP and have been developed in collaboration with Celsia Technologies.

The XP memory line-up is comprised of stand-alone modules and dual-channel kits. According to the company, the Ascent XP memory modules come in 2 GB DIMMS as well as in 2 x 2GB kits, rated to work at 1066 MHz for the DDR2 products and 2000 MHz in the DDR3 counterparts. The new products feature blistering speeds with clock latencies of 5-5-5-15 and 9-9-9-24 for DDR2 and DDR3, respectively.

Mushkin claims that the Ascent XP3-16000 DDR3 modules are factory-tweaked to deliver maximum performance when paired with an Nvidia 790i chipset-based motherboard. Since such memory modules run at ultra-high core frequencies, the manufacturer redesigned the cooling system from scratch.

The Ascent lineup now comes with refurbished heat spreaders, based on the eVCI (enhanced Vapor Chamber Interface) technology, developed by Celsia Technologies. The manufacturer touts the new cooling system as the most advanced RAM cooling solution on the market.

The eVCI cooler is built of two 123mm x 25mm copper vapor chambers, filled with pure water and vacuum sealed. The liquid is then absorbed by a copper wick and dissipated as vapors through a copper sheet with microscopic perforations. As soon as the vapors cool down, they return to the wick in liquid form.

"By combining high frequency memory chips into a package uniquely designed to handle increased heat and voltage demands, the Ascent product line offers gamers and other PC enthusiasts a new level of performance", said Brian Flood, director of product development for Mushkin. "The line boosts maximum performance by keeping the memory chips up to 48 per cent cooler using Celsia’s new eVCI technology", Flood continued.

There is no word on pricing and availability yet.


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