The next HTC flagship smartphone powered by Android, the M7 was expected to go official earlier this month at Consumer Electronics Show 2013, in Las Vegas.
However, that did not happen and the latest hearsay suggests HTC M7 might be announced
during a separate launch event ahead of Mobile World Congress 2013, which is set to kick off in late February.
Most of the handset’s specs sheet has already been leaked, but details on M7’s design and construction are a bit scarce for the moment.
Luckily, the folks over at Phonearena
spotted the M7’s components, which appear in a video made by ETradeSupply.com.
According to the leaked video, HTC’s flagship smartphone will feature an aluminum front plate casing. It measures 70mm x 130.7mm, which makes it big enough for a 4.7-inch display.