Intel to Detail Calpella, New Tech Innovations at IDF 2009

According to recent reports on the Internet, the Santa Clara, California-based world leading chip maker Intel is going to announce its updated roadmap at the upcoming Intel Developer Forum (IDF) show held in San Francisco from September 22 to 24. In addition, the company is also expected to detail a couple of new technology innovations as well as provide users with some details on its future products, including the much-anticipated Calpella platform for high-end notebooks or the equally anticipated Moorestown platform for MIDs.

In a recent news-article on Digitimes, citing market sources, Intel is said to be readying to announce a couple of details on the specifications of its Calpella platform for notebooks and the next-generation Moorestown platform for MID products. In addition, Chipzilla could also showcase a couple of engineering samples of the upcoming Moorestown-powered MIDs and reveal some more details on its next-generation Medfield platform for MIDs, due out in 2011.

The show will also be the place where Intel is expected to talk more about the recently announced collaboration with Nokia, as well as the company's solar cell subsidiary SpectraWatt. Furthermore, those attending the show will be able to set their eyes on the upcoming ultra-thin notebooks and the new Atom N450-based notebooks, which will be on display from various manufacturers in the field. Digitimes also reports that first-tier motherboard makers will be showcasing their latest P55-based models, which are to provide users with support for Intel's next-generation Core i5 processors.

According to Intel's website, at the IDF 2009 show, there will be a number of keynotes from some of the company's most important figures, including President and CEO, Paul Otellini, Senior VP of the Digital Enterprise Group, Pat Gelsinger, and David Perlmutter, Executive VP of the Mobility Group.