After that, it will shift from LGA to soldered BGA packages

Mar 22, 2013 11:52 GMT  ·  By

The worry caused by Intel's presumed decision to stop making normal central processing units continues to linger, but a new report might just lay those fears to rest for a few more years.

Central processing units can be classified according to various criteria, but going by their ability to unstick from a motherboard, there are only two types.

First off, there is the sort of CPU with pins or small, round “feet” of sorts, which go into compatible sockets and are held in place by a clamp and the cooler. Intel calls them LGA (land grid array).

Then, there are those that are soldered to whatever motherboard they are made for. Thus, they can never be removed, essentially becoming part of the mainboard itself, like the chipset.

Some time ago, rumors started about Intel preparing for a total shift from LGA to BGA.

Subsequent reports and statements were all about how no one should worry, since neither Intel nor AMD was actually going to suddenly go from one to the other.

Nevertheless, the implications lingered, and now we have a confirmation, of sorts, that Intel's move from LGA to BGA, while gradual, will happen.

According to Digitimes, LGA CPUs will keep being the major players until the first half of 2015. They will account for 95% of all packaging.

Only after that will LGA start giving way to more BGA, when the 14nm manufacturing process comes into play (Intel Broadwell).

In the meantime, customers who want to be able to upgrade from one CPU to the next can look forward to Intel Haswell (June 2013).

14nm Broadwell CPUs will be launched in 2014 and will have BGA packaging, but the Skydale, also set for 14nm node but 2015 release, will be LGA again.

On that note, Skydale may or may not be the last LGA CPU series from Intel Corp.