14 DAY TRIAL // At present, enthusiasts' mind processes are undoubtedly fully tasked with deciding on what six-core CPU to buy and, in case one already owns such a part, they are occupied with finding newer and less transistor-friendly ways to push their clocks over the top. This, of course, includes getting a hold of a suitable cooling solution, considering that reference coolers are hardly strong enough to keep up with the heat generated by overclocking.
Intel and Advanced Micro Devices don't exactly lay special emphasis on the cooling module they ship their chips with, being more focused on making their chips powerful and giving them a cooling mechanism only good enough to prevent them from frying under normal operating conditions. In the case of high-end parts, however, which are specifically meant for enthusiasts, these reference solutions are not enough.
Nowadays, enthusiasts that buy an Intel chip for its overlcocking potential do away with the chip's cooler very early on, after which they outfit it with a significantly superior module from players such as Thermaltake, Zallman and Cooler Master, among others. According to Fudzilla, Intel plans to remove this need by bundling its “K” unclocked chips with a special heatsink-fan assembly that should have heat-dispersing capabilities on par with high-end products from the aforementioned companies.
The cooler will have a clean, reflective, metal finish and will boast no less than six heatpipes, which should be enough to draw heat away from the chip even at clocks exceeding base specs. Additionally, the fan will have at least two speed settings, one predictably intended for silent operation and the other one used for performance. The “K” chips will debut in June, which means that the cooler should come out around the same time. Still, nothing is certain, especially considering that Fudzilla only managed to get hold of a rendered image of it.