Intel Embedded Core i3-2310E Sandy Bridge CPU Expected to Arrive in Q1 2011

Together with desktop and mobile Sandy Bridge processors, Intel also launched a series of embedded second generation Core CPU models, other such solutions being expected to make their debut in the first quarter of 2011, including the just detailed Core i3 2310E.

The yet to be released processor closely resembles the Core i3 2310M mobile part, as both models operate at 2.1 GHz, and incorporate two cores with 256KB per core of L2 cache memory.

In addition, the chips also feature 3MB of L3 cache, on-die integrated graphics clocked at 650MHz (up to 1.1GHz thanks to dynamic frequency switching), and share a similar feature set with that of the other Sandy Bridge CPUs.

This means that users will get Advanced Vector Extensions instructions, Hyper-Threading as well as virtualization support.

The only things missing are the AES instructions and Turbo Boost 2.0 support, but this is usual for the Core i3 processors available right now, being desktop, mobile or embedded.

The main difference between the Core i3 2310E and the mobile 2310M SKU is the type of packing used, as Intel decided to go for a BGA1023 socket, as well as the ECC memory support.

Intel Core i3 2310E will have a Thermal Design Power of just 35W and allows for up to 8GB of memory to be installed.

At the beginning of the year, Intel introduced two embedded quad-core CPUs, the Core i7 2710QE and i7 2715QE, both featuring 2.1GHz clock speed, Hyper-Threading and Turbo Boost 2.0 support as well as a 45W TDP.

Several more dual-core models are expected to follow soon, including the Core i7 2610UE and i7 2655LE as well as the Core i5 2510E and Core i5 2515E.

The Core i3 2310E is already detailed on Intel's website along with a Q1 2011 release date, pricing not being disclosed at this time. (via CPU-World)