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IDF: Nehalem-Based Calpella Mobile Platform, Branded as Centrino 3

It is expected to arrive on the market one year after the Montevina has been launched

By Bogdan Botezatu, Hardware Editor

2nd of April 2008, 14:35 GMT

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The Calpella platform will arrive one year after Montevina
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Intel has not yet finished introducing its upcoming Centrino 2 mobile platform, and details about the next one already started to pop out. According to Intel's Mobility Group General Manager Dadi Perlmutter, the other
mobile platform will be codenamed Calpella and will be entirely based on the Nehalem micro-architecture.

The technical details regarding the Calpella platform are still scarce as the platform is still in its early days, but Perlmutter claimed that it will deliver what the Montevina currently has, as well as some extra features.

Perlmutter also said that the new mobile architecture will be able to offer stunning visual experiences, much improved power management capabilities, enhanced wireless connectivity and more reliable security across the system.

"It's going to make mobile computing more personal and more desirable," he said. He also demonstrated the new power management technology for the Calpella platform, known as Adaptive Snoozing. The Calpella-based notebook will also be able to adjust its wireless throughput in accordance with the data being sent or received, thus sparing important amounts of energy.

The first demonstration was performed by streaming a video file over the web. When the video file is downloading, the wireless module operates in a "receive-only" mode, when the transmitter is sent into idle mode in order to preserve the battery power.

Calpella will pack Intel's highest-end hardware, such as a mobile Nehalem chip built on the 45-nanometer process node, with HyperThreading technology. Perlmutter refused to give additional details about the platform's specifications but implied that it might arrive one year after the Montevina platform has been launched.

The Nehalem breed of processors are the first chips to integrate a graphics core and an integrated DDR3 memory controller. Perlmutter also hinted at the fact that the first chips to take full advantage of the integration will be the mobile versions of Nehalem, since a built-in GPU will play a key role in power management.

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Intel | Montevina | Calpella | mobile platform | Centrino 3
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