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IDF: Nehalem-Based Calpella Mobile Platform, Branded as Centrino 3

- It is expected to arrive on the market one year after the Montevina has been launched

By: Bogdan Botezatu, Hardware Editor

Intel has not yet finished introducing its upcoming Centrino 2 mobile platform, and details about the next one already started to pop out. According to Intel's Mobility Group General Manager Dadi Perlmutter, the other
mobile platform will be codenamed Calpella and will be entirely based on the Nehalem micro-architecture.

The technical details regarding the Calpella platform are still scarce as the platform is still in its early days, but Perlmutter claimed that it will deliver what the Montevina currently has, as well as some extra features.

Perlmutter also said that the new mobile architecture will be able to offer stunning visual experiences, much improved power management capabilities, enhanced wireless connectivity and more reliable security across the system.

"It’s going to make mobile computing more personal and more desirable," he said. He also demonstrated the new power management technology for the Calpella platform, known as Adaptive Snoozing. The Calpella-based notebook will also be able to adjust its wireless throughput in accordance with the data being sent or received, thus sparing important amounts of energy.

The first demonstration was performed by streaming a video file over the web. When the video file is downloading, the wireless module operates in a "receive-only" mode, when the transmitter is sent into idle mode in order to preserve the battery power.

Calpella will pack Intel's highest-end hardware, such as a mobile Nehalem chip built on the 45-nanometer process node, with HyperThreading technology. Perlmutter refused to give additional details about the platform's specifications but implied that it might arrive one year after the Montevina platform has been launched.

The Nehalem breed of processors are the first chips to integrate a graphics core and an integrated DDR3 memory controller. Perlmutter also hinted at the fact that the first chips to take full advantage of the integration will be the mobile versions of Nehalem, since a built-in GPU will play a key role in power management.

MORE RELATED ARTICLES: Intel's Six-Core Powerhorses Will Not Arrive Until 2010 Alienware's Area-51 Gaming Rigs Meet World's Fastest Processor Nehalem-Ready “Smackdown” Mobo, Spotted in the Wild AMD Plans to Release Eight-Core Processors Until 2009 Intel's 32-Nanometer Chips: Between the Tick and the Tock Nvidia Pitches at Processor Business, Gears Up for VIA Takeover Pre-IDF Briefing: The Nehalem Chips, similar to AMD's Fusion Intel's Larrabee Gets Detailed at the Pre-IDF Briefing AMD's Shangai Die Size, Identical to the Nehalem's
 
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2nd April 2008, 14:35 GMT | Copyright (c) 2008 Softpedia | Contact:
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