Jan 18, 2011 09:10 GMT  ·  By

Collaborations are definitely not unheard of on the IT market, and IBM and ARM seems to have just entered one, their goal being to come up with new semiconductor technologies for mobile devices.

No long ago, Intel came out and said it will actually be able to beat ARM at its own game, that of low-power but capable mobile processors.

Whether or not ARM was impressed by this bold statement is still unclear, but it appears the outfit has begun to make new moves of its own.

One of them consists of a collaboration with IBM, one meant to lead to the creation of new semiconductor technologies for mobile products.

As expected, performance and power efficiency will go hand in hand, ARM IP set to be tuned to IBM's advanced manufacturing process technologies, all the day down to 14nm.

“IBM has a proven track record of delivering the core research and development that is relied upon by major semiconductor vendors worldwide for their advanced semiconductor devices,” said Simon Segars, EVP and general manager, ARM physical IP division.

“Their leadership of the ISDA alliance, which features a diverse set of top-tier companies as members, is growing in importance as consolidation trends in the semiconductor manufacturing industry continue,” he added.

“This agreement will ensure we are able to deliver highly tuned ARM Artisan Physical IP solutions on advanced ISDA process technologies to meet the early time-to-market our customers demand,” Segars went on to saying.

“The ARM Cortex processor family has become the leadership platform for the majority of smart phones and many other emerging mobile devices,” said Michael Cadigan, general manager, IBM Microelectronics.

“We plan to continue working closely with ARM and our foundry customers to speed the momentum of ARM technology by delivering highly advanced, low-power semiconductor technology for a variety of new communications and computing devices.”

The two will start with the development of design platforms by aligning the manufacturing process, physical IP and microprocessor design teams. The end result should be a series of better SoCs and an accelerated rate of technological advancement.