A photo of 4 iPhone motherboards before being loaded with chips has been leaked out, as well as an image showing the fully-loaded iPhone 5 logic board that is believed to hold the next-generation A6 SoC, or a variant of the A5X dual-core processor used in the third-gen iPad.
As the French
post ever-crisper images (and a video) of the iPhone 5 parts floating around the Apple supply chain, new images have emerged showing the logic board of the next-generation iPhone. 9to5mac
two such images, one showing four separate motherboards with no chips on them (yet), and another showing all the necessary electronics soldered in.
The person who leaked the latter, Sonny Dickson, reportedly stated that this image needed to be “enhanced with Photoshop,” which doesn’t add to its credibility one bit.
Nonetheless, with the iPhone 5 event so close, it hardly even matters. But we didn’t want our readers to miss out on this tidbit either, so there you have it.
There’s also a new image that shows Apple’s redesigned 9-pin plug up close (all but confirmed as well).
Apple is rumored to have tapped Taiwan Semiconductor Manufacturing Company (TSMC) with a $1 billion (€800 million) bid to secure a 28nm manufacturing process for the next-generation A6 chip for the iPhone 5, but the negotiations reportedly failed.
As such, the Cupertino, California-based computer giant continues to be stuck with Samsung, which currently makes the A4, A5, and A5X SoCs (system on a chip) for Apple’s iPhone, iPad, and iPod touch devices.
Apple is expected to send out the invitations to its rumored September 12 event late this week or early next week.
The company reportedly already has a second event planned for this fall, during which it will unveil a smaller version of the iPad, and updated iPods.