HTC M8, supposedly the next flagship smartphone from Taiwanese mobile phone maker HTC, has made an appearance over at the Bluetooth SIG, which proves that it is indeed nearing its official launch.
The handset was spotted on the certification website with model number 0P6BXXX / HTC6525LVW attached, which is in line with the previously unveiled details on it.
Apparently, HTC has had the phone submitted for certifications since last year, but the listing was published only yesterday, February 9.
When released, the handset will offer support for Bluetooth 4.0 technology, compliant with the following modules: HFP 1.6, HSP, A2DP, AVRCP 1.3, OPP, PBAP, FTP, HID, HOGP, MAP, PAN, FMP, and PXP.
No additional info on the handset’s hardware specifications has been offered as part of the Bluetooth SIG listing, though the software version loaded on it suggests that it is aimed at the US market.
As a recent post on Blog of Mobile notes, the phone was certified with three firmware flavors on top, namely 0.60.605.1 for Verizon Wireless, 0.60.502.1 for AT&T, and 0.62.531.1 for T-Mobile.
The handset’s HTC6525LVW model number also suggests that it will be launched in the US at Verizon.
According to the previous reports on HTC M8, it will be released with a 5-inch touchscreen display capable of delivering a full HD resolution, as well as with a quad-core Snapdragon 800 MSM8974AB processor packed inside.
Moreover, it is expected to feature 2GB of RAM, along with 16GB of internal memory, most probably paired with a microSD memory card slot for expansion purposes.
It should pack twin 4MP UltraPixel cameras on the back, complemented by a 2MP front camera for making video calls while on the go.
HTC M8, supposedly set to hit shelves as HTC One 2 or One Plus (One+), is rumored to run under Android 4.4 KitKat, with a new Sense 6.0 UI loaded on top. The phone might become official soon, so stay tuned for more details on its capabilities.