Fujitsu Microelectronics Limited has recently announced the release of new mobile WiMax chipset optimized devices, including smart phones and PDAs. August 2008 has been set by Fujitsu as the launch time frame for the sample shipment. A baseband LSI (MB86K22), an RF LSI (MB86K52) and a power management LSI (MB39C316) are included on the chipset. Competitive WiMax modules need the three devices as essential components. They have been designed to allow the WiMax module feature 12×12mm. There will only be a max 0.5mA standby current, allowing for the development of attractive mobile WiMax terminals.

The fully integrated MB86K22 baseband LSI has been built using Fujitsu Microelectronics' 65nm advanced CMOS low-leakage process technology. Compared to the previous generation of devices, the operating power of the MB86K22 has been cut down by 36%. The power supply in the unused blocks inside the device is reduced by a power-gating technology, enabling the WiMax module to consume only 0.5mA, prolonging the battery life this way.

Almost all the frequencies set by the WiMax Forum, namely 2.3GHz, 2.5GHz and 3.5GHz, are supported by the MB86K52, an RF LSI built using CMOS process technology, which provides great flexibility. Mobile WiMax terminal manufacturers are allowed this way to introduce global WiMax devices. Essential elements for mobile WiMax Wave 2, including MIMO and beam forming technology, are also supported by the MB86K52.

The MB39C316 power management LSI accommodates one cell battery and eliminates this way all the complex and time-consuming power management requirements. The peripheral components outside of the module are also minimized through this design. The module's power schemes are controlled and managed by the MB39C316 at the system level, enabling the lowest power consumption available for each operation.

The samples of Fujitsu Microelectronics' Mobile WiMAX chipset available in August 2008 will have a $74.8 price tag.