BIPV solar modules seamlessly integrated into the building structure

Aug 7, 2012 00:21 GMT  ·  By
Rendition of Ascent's flexible thin-film photovoltaic modules placed on a building
   Rendition of Ascent's flexible thin-film photovoltaic modules placed on a building

iPhone and iPad assembler Foxconn has chosen Ascent Solar Technologies, Inc., a developer of flexible thin-film photovoltaic modules, to provide BIPV solar modules in a pilot application at Foxconn’s new factory in Zhenzhou City, Henan Province, China.

As the world’s largest maker of electronic devices, Foxconn is Apple’s primary assembler of iPhones and iPads, as well as MacBook Pro computers.

A new plant in Zhenzhou City, Henan Province, will use Ascent’s flexible and lightweight form factor to integrate BIPV solar modules seamlessly into the building structure. According to Ascent, traditional glass-back photo-voltaic technology cannot achieve this.

“The integration of the modules will allow the factory to utilize cost-effective, high-performance solar power utilizing Ascent’s industry leading CIGS technology to deliver the highest power density available on thin-film plastic substrates,” said the company.