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February 4th, 2009, 11:14 GMT · By

Despite Financial Trouble, Qimonda Marches On

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Qimonda announces smallest 2GB DDR3 memory chip
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Despite having encountered a number of problems, due to the ongoing global economic crisis, memory maker Qimonda has just announced that it has finished the first functional module based on the smallest 2GB memory chip ever announced in the DRAM industry. The new chip has been designed using the company's leading 46 Buried Wordline technology, enabling a significant increase in productivity, compared to current technologies.

 

“With the first functional chips on 46nm, Qimonda shows the potential to regain technology leadership in the DRAM industry," said Kin Wah Loh, president and CEO of Qimonda AG. "The new 2 Gigabit DDR3 is expected to significantly increase our productivity and reduce our cost per bit once it is ramped up in production. In addition, the new chip is ideally suited for high-density DDR3 server modules and will put us in the position of the energy efficiency leader in the market.”

 

Qimonda's current 46nm technology enables the company to benefit from three times more chips per wafer, compared to the 75nm technology. Also, it will provide for a significant reduction in power consumption, up to 75 percent in high-density DDR3 modules. According to Qimonda, the new 2 Gigabit memory chip comes as an ideal product to help drive the adoption of the DDR3 memory technology, consequently replacing the older DDR2.

 

“Qimonda delivered DDR3 memory modules that are industry leading in performance and power allowing optimal system performance on Intel platforms,” said Pat Gelsinger, senior vice president, INTEL CORPORATION, and general manager, Digital Enterprise Group, recognizing Qimonda's top position in the DDR3 technology.

 

In regard to the financial issues that the memory maker has recently encountered, due to the ongoing economic crisis, Qimonda said that no final decision had been made concerning the future of the company's structure. Just recently, Qimonda has filed an application for insolvency.


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