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DDR3 Memories in 2008 Future DDR3 Specs proposed by AMD and SIMPLETECH	By Bogdan Solca, Hardware Editor 14th of September 2006, 14:31 GMT Adjust text size:


Advanced Micro Devices Inc. and SimpleTech Inc. announced a joint effort to define registers and other specifications for the future DDR3-based SDRAM memory modules. The two American companies are ready to define and develop SDRAM registered dual-inline memory modules (RDIMMs) which will come as a natural evolution over current DDR2. JEDEC, an alliance of 270 companies focused on the creation of open standards, is officially supporting AMD and SimpleTech. EETimes states that the two companies specifically delineated their roles in defining the overall solution. AMD is responsible for the timing for the interface and termination characteristics, while SimpleTech is mapping out the register component to support standard height and VLP-ATCA applications. The future DDR3 modules will support unified register and PPL functions for an overall reduced power consumption. SimpleTech is also responsible for the initiation of the inside-out dual fly-by signaling approach that will be incorporated into all future DDR3 RDIMM layouts that will range from 512-MB to 32-GB densities. JEDEC is currently validating the specifications, testing is scheduled for 2007 and the full production process is due 2008.

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