With summer steadily approaching and more CPUs always coming out entrancing PC owners, the need for better cooling mechanisms is paramount, and Cooler Master, as its name implies, is quite eager to address all of these concerns. That said, the company has built on its expertise and has combined a high efficiency with a small form factor to yield a sturdy and strong low profile cooler known as the Vortex plus.
Since a low profile automatically means a smaller heatsink, it falls to the materials used, the way the heatpipes are aligned and the actual shape, size and number of fins on the heatsink itself to bear the brunt of heat dissipation. As such, Cooler Master built the Vortex Plus with four copper heatpipes which come in direct contact with the central processor itself, which means that heat will be more quickly led away from the chip and into the aluminum heatsink. Any caloric energy is then dispersed by the fan.
The entire cooling module measures 116 x 100 x 84 mm and weights 445 grams, but the fan has a size of 92mm (92 x 92 x 25 mm). This long life sleeve-bearing spinner can operate at rotary speeds between 800 and 2400 RPM and, consequently, delivers an airflow of 15.7 to 54.8 CFM and pressures of 0.35-4.27 mm H2O. Regardless of the rotation, however, the sound output will never go above 35 dBA. Finally, the fan has a mean time before failure of 40,000 hours.
For a touch of reliability, endurance and, just as importantly, silence, the Cooler Master Vortex Plus cooler is bundled with anti-vibration rubber pads for the fan mounting. Expected to become available soon, the low profile heat disperser will be compatible with Intel LGA 775, LGA 1156 and LG 1366 central processor, as well as socket 754/939/940/AM2/AM3 CPUs from Advanced Micro Devices. Unfortunately, the price is still shrouded in mystery.