14 DAY TRIAL // BlackBerry Z10, the first smartphone that landed on shelves with the new BlackBerry 10 operating system loaded on top, has been already torn to pieces, showing appealing hardware packed inside.
The smartphone, the first in the new generation that Canadian mobile phone maker BlackBerry has launched on January 30, packs internals similar with high-end smartphones out there, such as Galaxy S III LTE and others.
The guys over at TechInsights were those curious enough to tear the phone down to have a look inside it, and they have already shared their findings with the world.
BlackBerry Z10 arrives on shelves with a Qualcomm MSM8960 Snapdragon S4 baseband / applications processor, paired with Samsung K3PE0E000A 2 GB Mobile DDR2 SDRAM and Samsung KLMAG2GE4A 16 GB MLC NAND Flash.
Furthermore, the handset features Qualcomm WCD9310 Audio Codec and Qualcomm PM8921 power management chip, along with a Qualcomm RTR8600 GSM / CDMA / W-CDMA / LTE RxD Transceiver + GPS.
There’s also a Texas Instruments WL1273L single-chip for 802.11a/b/g/n WLAN, Bluetooth, and FM Radio, along with a TriQuint TQP6M9017 dual-band WLAN Module.
Other chips inside the new BlackBerry 10 handset include: Avago ACPM-5017 LTE Band XVII Power Amplifier, Avago ACPM-7051 Quad-Band GSM / W-CDMA Bands I & V Power Amplifier, and RF Micro Devices RF7252 and RF Micro Devices RF7303 CDMA and LTE amplifiers.
BlackBerry also packed the smartphone with a Sony CXM3582UR SP10T Antenna Switch, Inside Secure SECUREAD IC5C633I4 NFC Solution Module, STMicroelectronics LIS3DH MEMS Accelerometer, STMicroelectronics LSM330DLC for 3D Accelerometer and 3D Gyroscope, and Synaptics Clearpad 3203 Touchscreen Controller.
As CrackBerry notes, there are other key components inside the new smartphone as well. Those who would like to see the BlackBerry Z10 torn to pieces and to learn some more info on the components found inside it should have a look at this post on ubmtechinsights.