14 DAY TRIAL // Portable computers have long been on the path to becoming lighter and thinner, but there is only so far this can go using conventional technology. In the race to keep ahead of competitors, a recent Apple filing discloses methods for improving enclosure designs through parts that are structurally and electrically bonded together during the manufacturing process.
This technique offers a viable alternative to the current approach used by notebook manufactures, which tend to have weighty mechanical assemblies having parts that are screwed, riveted, snapped or otherwise fastened together at discrete points. Some enclosures make use of lighter plastic structures and fewer fasteners, but these are more flexible and thus tend to buckle and bow. Neither of the two is desirable according to Apple because increased weight leads to customer dissatisfaction while bowing may damage the internal components of the portable computer. Another key factor is the power and sophistication of integrated notebook circuits, which has increased, and with it, the levels of electromagnetic interference. That's why manufacturers started to shield enclosures with an electrically conductive material to block the emission of electromagnetic radiation, which also leads to more weighty and bulky designs.
Apple's patent proposal covers an enclosure that has at least two unique parts which are structurally bonded together to form a singular composite structure with structural glue, or an enclosure having at least two unique parts that are electrically bonded together to form a singular integrated conductive member. This will allow manufacturers to build tiny enclosures around a set of internal components, instead of doing things the other way around and having to maneuver these into pre-formed cases or make use of heavy fasteners in order to achieve the same result.
The patent proposal, simply entitled 'Computer enclosure' fits in well with reports and rumors regarding Apple's plans to re-enter the sub-notebook market later this year with its thinnest and lightest Intel-based notebook yet.