Will allow ARM physical IP to be developed across TSMC nodes

Jul 20, 2010 10:22 GMT  ·  By

Though it may have had a rough period with the 40 nm manufacturing process, TSMC, if anything, actually appears to be thriving now that the final issues are being resolved. In fact, the foundry has even started to enter new, long term deals in order to further expand its business outlook. The latest in this series of agreements was just made with ARM, and will let their mutual customers make optimized SoCs based on ARM processors and covering a wide range of nodes, all the way down to 20nm.

The pact gives TSMC the possibility of optimizing ARM chip implementations on its processor technologies. Said implementations include, among other things, the Cortex family of chips and the CoreLink interconnect fabric for AMBA protocols. ARM physical IP, such as memory products and standard cell libraries, will also be manufactured, based on TSMC's more advanced 28nm and 20nm technologies. Basically, the two will jointly create TSMC process-optimized core implementations for benchmarking of optimal performance, area and power. Finally, targeted market segments will be portable computing, tablet PCs, HPC applications and wireless.

“The signing of this agreement is a significant semiconductor industry milestone because it formalizes a forward looking, long-term relationship between two of the industry’s leading companies,” explained Mike Inglis, executive vice president and general manager, ARM Processor Division. “I am pleased that ARM and TSMC will be working together to enable ARM processor based SoCs leveraging both companies’ advanced technologies.”

“We believe this effort will enhance the value of our Open Innovation Platform that efficiently empowers innovation throughout the supply chain,” said Dr. Fu-Chieh Hsu, Vice President of Design and Technology Platform and Deputy Head of R&D at TSMC. “The combination of ARM’s industry leading IP and TSMC’s world-class technology and manufacturing provides our mutual customers with compelling benefits for advanced semiconductor applications.”