At the AMD Fusion 11 Taipei conference that took place at the beginning of this month, AMD has disclosed additional details about its next-generation Radeon HD 7000 series graphics cards, including the fact that high-end solutions will come with a new liquid chamber cooling solution.
AMD had on display such a cooler during the conference together with a slide that detailed the main differences between its cooling technology and the one utilized by its competitors in vapor chamber designs.
The technology is going to be used by all of AMD's partners who follow the reference design set by the chip maker for the Radeon HD 7900 series graphics cards.
As most of you know, AMD's upcoming Radeon HD 7000 graphics card series will be comprised of low- and mid-range solutions based on the VLIW4 architecture introduced with the Radeon HD 6900 GPU series as well as from high-end solutions in the HD 7900 range.
These will use the Next Generation Core (NGC) architecture that we have covered in a series of previous articles, so we are not going to get into this now, but the key aspect of NGC is that it will improve the performance and functionality of GPGPU computing.
According to Corporate VP & General Manager of AMD’s Graphics Division Matt Skynner, 28nm GPUs will start shipping later this year, while the first samples of mobile chips have already been released.
As far as the desktop parts are concerned, it seems like these won't be launched until the Q2 or Q3 of 2012, confirming our previous reports regarding the delay of this GPU series.
From the leaks that made it our way until now, we know that the entry-level and mid-range Radeon HD 7000 GPUs will be known by the code name of Thames and Lombok, while the NCG HD 7900 series will use the Tahiti designation. (via WCCFTech)