Sep 4, 2010 07:34 GMT  ·  By

True to what reports suggested last month, Advanced Micro Devices took advantage of IFA 2010, Berlin, to show off its first Fusion processors, and it seems that the Ontario chip has finally broken cover and allowed itself to be photographed, revealing a very compact package.

As consumers probably know by now, AMD is making the final preparation for the release of its next generation of processors, based on the Bulldozer and Bobcat architectures.

For those interested in a reminder, the Bulldozer will spawn chips for desktop and servers systems, whereas Bobcat will yield mobile chips.

The Ontario is the first Bobcat chip that will come to market and is, naturally, an APU (Accelerated Processing Unit) based on the Fusion architecture.

Now, with IFA in full swing, Computerbase.de managed to snatch an actual picture of its, revealing a very small package the size of a 1 Euro coin.

This seems in line with its maker's claim that, at half the die area (under 100 square mm), the Ontario will still deliver “mainstream performance.”

Basically, Ontario is a dual-core x86 CPU (central processing unit) with a DirectX 11-capable integrated GPU (graphics processing unit) aimed at low-power devices.

AMD expects the Ontario to be used in tablets, netbooks and handheld electronics where the TDP of 9W will be a prime asset.

As for the design itself, the company employed a ball-grid array (BGA), meant to permanently fix the chip to the system board, and the package lacks an integrated heatspreader.

According to the report, a higher-performance APU known as “Zacate”, with a TDP of 18W, will end up in ultra-thin notebooks, slim all-in-one PCs and nettops, among other things.

The Ontario and Zacate, as they are OEM products, will start shipping to system builders in the fourth quarter of 2010. Devices based on them should make their appearance soon after that.