Sunnyvale, California-based Advanced Micro Devices is expected to update its platform for ultra-thin notebook systems, with the introduction of its anticipated Congo platform, which has been postponed from the end of July to early November, due to low demand in the market for ultra-thin notebooks. According to recently leaked details, the platform is expected to be launched sometime at the end of October or the beginning of November, letting PC vendors pair the chip maker's new platform with the highly anticipated Windows 7 operating system.

 

In a recent news-article on Digitimes, the famous sources at notebook manufacturers are quoted as claiming that AMD is preparing to launch its next-generation platform for ultra-thin notebooks sometime at the end of this month, or in early November. The platform, codenamed Congo, will eventually replace the chip maker's current product, called Yukon, and will provide manufacturers with a choice for a dual-core Turion Neo X2 L625 or Athlon Neo X2 L335/L325 processor, or a single-core Athlon Neo MV-40 processor with the M780G chipsets.

 

Despite the fact that the platform hasn't been officially introduced, HP has recently updated its product portfolio with the introduction of the DV2-1113AX, 12.1-inch ultra-thin notebook, boasting the aforementioned Athlon Neo MV-40 CPU combined with the RS690E chipset from the Yukon platform. Other system vendors are likely to follow but their names aren't known yet.

 

Said sources also spoke about the Nile and Brazos platforms, also designed for the ultra-thin notebook space and expected to launch in the next two years. In addition to these platforms for ultra-thin laptops, AMD also plans to launch the Tigris, which is due out after the launch of Microsoft's Windows 7. The platform will come with 45nm processors, from the Sempron M100 to Athlon II M300, Turion II M500 or Turion II Ultra M600 series.